Qualcomm Snapdragon flaws impact Lenovo, Microsoft, Lenovo, and Samsung devices
Vulnerabilities mentionedAll →
| CVE | Vulnerability | CVSS | EPSS | Flags | Affected | Exposure | Published |
|---|---|---|---|---|---|---|---|
| CVE-2022-33276 | Memory corruption due to buffer copy without checking size of input in modem while receiving WMI_REQUEST_STATS_CMDID command. Memory corruption due to buffer copy without checking size of input in modem while receiving WMI_REQUEST_STATS_CMDID command. NVD description · AI analysis pending | 7.8 group max | <1% |
| — | ||
| CVE-2022-40516 | Memory corruption in Core due to stack-based buffer overflow. Memory corruption in Core due to stack-based buffer overflow. NVD description · AI analysis pending | 7.8 group max | <1% |
| — | ||
| CVE-2022-40520 | Memory corruption due to stack-based buffer overflow in Core Memory corruption due to stack-based buffer overflow in Core NVD description · AI analysis pending | 7.8 | <1% |
| — | ||
| CVE-2022-33265 | Memory corruption due to information exposure in Powerline Communication Firmware while sending different MMEs from a single, unassociated device. Memory corruption due to information exposure in Powerline Communication Firmware while sending different MMEs from a single, unassociated device. NVD description · AI analysis pending | 9.8 | <1% |
| — | ||
| CVE-2022-33266 | Memory corruption in Audio due to integer overflow to buffer overflow while music playback of clips like amr,evrc,qcelp with modified content. Memory corruption in Audio due to integer overflow to buffer overflow while music playback of clips like amr,evrc,qcelp with modified content. NVD description · AI analysis pending | 7.8 group max | <1% |
| — | ||
| CVE-2022-33274 +1 in the same advisory: …33300 | Memory corruption in android core due to improper validation of array index while returning feature ids after license authentication. Memory corruption in android core due to improper validation of array index while returning feature ids after license authentication. NVD description · AI analysis pending | 7.8 | <1% |
| — | ||
| CVE-2022-33290 +1 in the same advisory: …33299 | Transient DOS in Bluetooth HOST due to null pointer dereference when a mismatched argument is passed. Transient DOS in Bluetooth HOST due to null pointer dereference when a mismatched argument is passed. NVD description · AI analysis pending | 7.5 | <1% |
| — |
Full article344 words · extracted from securityaffairs.com · click to collapse
Tens of software vulnerabilities affected Qualcomm firmware and impacted the devices of Microsoft, Lenovo, and Samsung.
Qualcomm January 2023 security bulletin addressed 22 software vulnerabilities in its Snapdragon suite. Some of the flaws were reported by the efiXplorer Team at the firmware protection firm Binarly, Zinuo Han of OPPO Amber Security Lab, Gengjia Chen from IceSword Lab, the researchers nicolas (nicolas1993), Seonung Jang of STEALIEN, and Le Wu of Baidu Security.
Below are reported the most severe vulnerabilities addressed by the company:
| Public ID | Security Rating | CVSS Rating | Technology Area | Date Reported |
|---|---|---|---|---|
| CVE-2022-33218 | Critical | High | Automotive | Internal |
| CVE-2022-33219 | Critical | Critical | Automotive | Internal |
| CVE-2022-33265 | Critical | High | Powerline Communication Firmware | Internal |
| CVE-2022-25725 | High | Medium | UTILS | Internal |
| CVE-2022-25746 | High | High | KERNEL | Internal |
| CVE-2022-33252 | High | High | WLAN Firmware | Internal |
| CVE-2022-33253 | High | High | WLAN Firmware | Internal |
| CVE-2022-33266 | High | Medium | Audio | Internal |
| CVE-2022-33274 | High | High | Android Core | Internal |
| CVE-2022-33276 | High | High | WLAN Firmware | Internal |
| CVE-2022-33283 | High | High | WLAN Firmware | Internal |
| CVE-2022-33284 | High | High | WLAN Firmware | Internal |
| CVE-2022-33285 | High | High | WLAN Firmware | Internal |
| CVE-2022-33286 | High | High | WLAN Firmware | Internal |
| CVE-2022-33290 | High | High | Automotive Connectivity | Internal |
| CVE-2022-33299 | High | High | Automotive Connectivity | Internal |
| CVE-2022-33300 | High | High | Automotive Android OS | Internal |
| CVE-2022-40516 | High | High | Boot | 10/28/2022 |
| CVE-2022-40517 | High | High | Boot | 10/28/2022 |
| CVE-2022-40520 | High | High | Connectivity | 10/28/2022 |
The most severe flaw is an integer overflow to buffer overflow in Automotive tracked as CVE-2022-33219 (CVSS Score 9.3).
“Memory corruption in Automotive due to integer overflow to buffer overflow while registering a new listener with shared buffer.” reads the advisory.
Other two severe issues fixed by Qualcomm are:
- CVE-2022-33218 (CVSS Score 8.2) – the flaw is a Memory corruption in Automotive due to improper input validation.
- CVE-2022-33265 (CVSS Score 7.3) – the flaw is an Information exposure in Powerline Communication Firmware.
The flaws impacted laptops and other devices using Snapdragon chipsets that are manufactured by Lenovo, Microsoft, and Samsung.
Lenovo released updates to address the vulnerabilities impacting the ThinkPad X13s BIOS.
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