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DeepSeek-v4.1 Flash: Pushing the Limits of KV Cache Compression

DeepSeek-V4.1 Flash is a 552B-parameter multimodal MoE model with 1M-token context achieving 4x KV cache compression for long-horizon agent workloads.

A detailed analysis of the DeepSeek-V4.1 Flash technical report describes a 552B-parameter multimodal mixture-of-experts model supporting contexts up to 1 million tokens. Its Causal Encoder-Decoder (CED) architecture activates 8B parameters during prefill and 16B during decode, and reportedly delivers about 420 tokens/s. Joint optimization of architecture (CSA2 cross-layer compression), FP4 KV cache precision, and deployment strategy cuts runtime KV cache to roughly 1/4 and persistent KV cache to about 1/8 of DeepSeek-V4-Flash at the same sequence length, targeting storage and bandwidth bottlenecks in long-horizon agent serving. The author notes all DeepSeek-V4 Pro models were taken offline following the release.

SK Hynix reportedly in talks with Intel to build memory chips in US

SK Hynix is reportedly negotiating with Intel to manufacture memory chips in the US, possibly leasing space at Intel's Ohio fab.

Reuters reports SK Hynix and Intel have discussed SK Hynix producing RAM in the US for the first time, including leasing space at Intel's planned Ohio factory or forming a joint venture that could include cloud-service providers; SK Hynix says nothing is finalized. The company is already building a $3.8 billion AI chip packaging and research facility in West Lafayette, Indiana, with mass production expected to begin in 2029, amid surging HBM demand from AI data centers. The potential deal could face a South Korean government review over transfers of strategically important chip technology, and follows Intel's 2020 sale of its NAND flash business to SK Hynix for $9 billion.

TechCrunch · AI · 17h agoAI industry