Search: “fab provider”

4 stories in the last 3d

Searchkeyword smart Sortlatest hot importance relevance

DomainAll Cyber AIWindow24h 3d 7d 30d AllIn the wild Important only Show duplicates

CategoryAll Vulnerability 4 AI industry 2

SeverityAll critical 0 high 0 medium 4 low 0 info 2

CVE-2026-86466: Apache Airflow FAB provider: FAB Authentik provider: id_token issuer/audience not validated

Apache Airflow FAB provider before 3.9.0 skips issuer/audience validation on Authentik id_tokens, allowing tokens minted for other clients to authenticate to Airflow.

CVE-2026-86466 affects apache-airflow-providers-fab before 3.9.0. The Authentik OAuth path in the FAB auth manager does not validate the issuer or audience claims of accepted id_tokens. An attacker holding a token minted by the same Authentik identity provider for a different client application can present it to Airflow and be authenticated. Severity is rated moderate by the reporter.

oss-securitySep 15, 20:01 UTC · 1d agoVulnerability 3 sources CVE-2026-864661

CVE-2026-82310: Apache Airflow FAB provider: FAB auth manager: deactivated users retain and renew Core API JWT access

Apache Airflow FAB provider 2.0.0-3.8.x lets deactivated users keep unexpired Core API JWTs and mint replacements indefinitely.

CVE-2026-82310 affects apache-airflow-providers-fab versions 2.0.0 before 3.9.0. Deactivating a user account does not stop tokens issued before deactivation. While password authentication correctly rejects the disabled account, the Core API continues to accept an existing unexpired token naming it and lets that token mint a replacement. Severity is rated moderate.

oss-securitySep 15, 19:56 UTC · 1d agoVulnerability CVE-2026-82310

SK Hynix reportedly in talks with Intel to build memory chips in US

SK Hynix is reportedly negotiating with Intel to manufacture memory chips in the US, possibly leasing space at Intel's Ohio fab.

Reuters reports SK Hynix and Intel have discussed SK Hynix producing RAM in the US for the first time, including leasing space at Intel's planned Ohio factory or forming a joint venture that could include cloud-service providers; SK Hynix says nothing is finalized. The company is already building a $3.8 billion AI chip packaging and research facility in West Lafayette, Indiana, with mass production expected to begin in 2029, amid surging HBM demand from AI data centers. The potential deal could face a South Korean government review over transfers of strategically important chip technology, and follows Intel's 2020 sale of its NAND flash business to SK Hynix for $9 billion.

TechCrunch · AISep 16, 13:23 UTC · 16h agoAI industry

Building the materials foundation for AI

Syensqo's CTO says AI pushes semiconductors and data centers to physical limits, driving advanced materials demand and AI-accelerated materials discovery.

MIT Technology Review's Business Lab podcast, produced in partnership with Syensqo, features CTO Mike Finelli discussing how AI workloads push semiconductors and data centers to physical limits in performance, thermal management, and reliability. Syensqo develops high-voltage data center materials, semiconductor sealing materials, and immersion cooling fluids, while using AI agents to digitally synthesize millions of molecular combinations and predict performance before lab testing. Finelli describes a reinforcing cycle where AI improves materials that in turn enable better AI infrastructure.

MIT Technology Review · AISep 16, 12:47 UTC · 16h agoAI industry1