CVE-2018-11976

—

CVSS 3.0

5.5 medium

EPSS

<1%p10

Published

May 24, 2019 (May 24, 2019)

Modified

Jun 17, 2026

Description

ECDSA signature code leaks private keys from secure world to non-secure world in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in IPQ8074, MDM9150, MDM9206, MDM9607, MDM9650, MDM9655, MSM8909W, MSM8996AU, QCA8081, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130

Vendors: qualcomm
Products: ipq8074 firmware, mdm9150 firmware, mdm9206 firmware, mdm9607 firmware, mdm9650 firmware, mdm9655 firmware, msm8909w firmware, msm8996au firmware, qca8081 firmware, qcs605 firmware, qm215 firmware, sd 210 firmware
Weakness: CWE-200
Vector: CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:N/A:N

NVD CVE.org GitHub PoCs EPSS (0.2%)

In the news2 stories

Critical flaw in Qualcomm chips exposes sensitive data for Android Devices

Security AffairsApr 28, 14:22 UTC · Apr 28, 2019Vulnerability CVE-2018-11976

Qualcomm chips leak crypto data from secure execution environment

Help Net SecurityApr 25, 00:00 UTC · Apr 25, 2019Vulnerability CVE-2018-11976