ASML locks in TSMC, Samsung, and Intel while Huawei races to break its grip
ASML secures TSMC, Samsung, and Intel commitments for twelve-inch photomasks while Huawei funds China's DUV lithography push to bypass export controls.
ASML, the world's only EUV lithography maker, has locked in commitments from TSMC, Samsung, and Intel to move photomasks from six-inch to twelve inches, which ASML CTO Marco Pieters says could raise High-NA throughput by 40 percent; TSMC and ASML plan a test line by 2031 with production on High-NA tools by 2033. Meanwhile Huawei is orchestrating China's push to build DUV lithography equipment and reduce dependence on ASML, centered on Shanghai equipment maker Yuliangsheng, with SMIC testing the machines and Huawei's Habo fund backing Zeiss rivals and light-source developers. Bernstein analysts note the main bottlenecks remain projection lenses and light sources.