ASML locks in TSMC, Samsung, and Intel while Huawei races to break its grip
ASML secures TSMC, Samsung, and Intel commitments for twelve-inch photomasks while Huawei funds China's DUV lithography push to bypass export controls.
ASML, the world's only EUV lithography maker, has locked in commitments from TSMC, Samsung, and Intel to move photomasks from six-inch to twelve inches, which ASML CTO Marco Pieters says could raise High-NA throughput by 40 percent; TSMC and ASML plan a test line by 2031 with production on High-NA tools by 2033. Meanwhile Huawei is orchestrating China's push to build DUV lithography equipment and reduce dependence on ASML, centered on Shanghai equipment maker Yuliangsheng, with SMIC testing the machines and Huawei's Habo fund backing Zeiss rivals and light-source developers. Bernstein analysts note the main bottlenecks remain projection lenses and light sources.
- ASML is the sole EUV maker; TSMC, Samsung, and Intel commit to twelve-inch photomasks.
- Twelve-inch masks could raise High-NA throughput by 40 percent; TSMC test line planned by 2031.
- Huawei backs Yuliangsheng DUV machines and Zeiss-rival optics to route around export controls.
- Yuliangsheng aims to produce twelve DUV machines by year-end but remains far behind ASML.
- Vendors
- ASMLHuaweiYuliangsheng
- Countries
- ChinaUnited StatesNetherlands
From the original article
3 min read at the-decoder.com
ASML has won over Samsung, TSMC, and Intel to switch to larger photomasks, which should boost the throughput of its newest EUV machines by 40 percent. Meanwhile, Huawei is orchestrating China's counter-strategy, aiming to break its dependence on the Dutch lithography technology through equipment maker Yuliangsheng and its own suppliers.
By Maximilian Schreiner · the-decoder.com
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